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      Mobile Communications

      Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

      AD8312 Plus Series

      Automatic Die Bonding System (12” wafer handling)

      AUTOPIA

      Automatic Active Alignment System (for Automotive Camera Application)

      COSMOS

      Automatic 3D Sensing Alignment System

      Eagle AERO

      For High-end IC Applications

      FIREBIRD TCB Series

      Automatic Thermal Compression Bonding System

      Ultrasonic Wedge Bonder

      HERCULES

      Heavy Aluminum Wire Bonding System

      Transfer Molding

      IDEALmold? 3G

      Automatic Encapsulation Solution (strip / reel form substrate handling)

      Lens Holder Attach System

      IS600GS

      Automatic Active Alignment Bonding System for Camera Module Assembly

      Lens Holder Attach System

      IS868LA3

      Automatic Lens Holder Attach System

      DI-water Cleaning System

      ISCM868S

      Automatic DI-Water Cleaning System

      ISLinDA

      Automatic Die Bonding System (12” wafer handling)

      MP-TAB Series

      Automatic Trim & Form System

      Other Applications

      国产av国片